Advanced Process
Sub-2nm nodes and the leading-edge processes driving the next compute generation.
Taiwan's most international — and only dedicated — semiconductor exhibition, where the most influential companies, talent and technologies across the global chip ecosystem converge to spark new market opportunities.
The technology arcs shaping this year's forums and show floor.
Sub-2nm nodes and the leading-edge processes driving the next compute generation.
Chiplets, advanced packaging and 3D stacking that keep scaling alive beyond Moore.
Co-packaged optics and light-based interconnect for AI-era bandwidth.
HBM and next-generation memory feeding accelerated computing.
SiC, GaN and power devices for energy, mobility and electrification.
Superconducting and ion-trap systems moving from lab to market.
AI and embodied robotics for autonomous, resilient fabs.
Greener manufacturing and cyber-resilience across the supply chain.
Surface the trends and breakthroughs that set the direction for the global industry.
Move ideas from research into manufacturing through deep, expert-led programs.
Bridge industry, government, academia and research, and connect Taiwan to the world.
20+ expert programs run Aug 31–Sep 4 — search, filter by track, tap a card for detail.
Every international forum in chronological order with exact times and venues (Aug 31–Sep 4). Forums are spread across Taipei Nangang (TaiNEX) and nearby hotels — check the venue for each session.
Four spotlight technology zones plus a workforce pavilion anchor this year's show floor.
How the week unfolds — forums open Aug 31, the exhibition runs Sep 2–4.
Different visitors, different routes. Pick the profile that fits you for a tailored set of forums, zones and tips.
Dates, venue, tickets and official links — everything you need to plan the trip.
Take a break with four bite-sized, semiconductor-themed games — match chips, beat the forum quiz, sort wafers and shrink process nodes.