Live Coverage

What was actually said, shown and announced during show week — every item linked to its original source.

The week in one picture

Swipe or use the arrows — a few takes on the same story.

English infographic: SEMICON Taiwan 2026, the transformation to AI infrastructure. Panels cover Google's AI infrastructure chief making his Asia keynote debut, the US$1 trillion year arriving four years early, advanced packaging shifting to a dedicated Chiplet pavilion, hyperscalers joining the main stage alongside TSMC and MediaTek, a US$2 trillion revenue target by 2030, and quantum and smart fab debuting as standalone zones. Footer figures: 1,300+ exhibitors, 4,300+ booths, 65 countries represented, 18 national pavilions, 100,000+ professional visitors.
The shift, in detail
English infographic in a soft hand-drawn style: the show moving from a chip manufacturing show to an AI infrastructure hub, the US$1 trillion milestone reached four years earlier than predicted, Google's Asia keynote debut, silicon photonics and CPO as the week's central themes, new specialised zones for quantum technology, smart fab and chiplet packaging, and a record 18 countries in the global pavilions. Scale: 1,300+ exhibiting companies, 4,300+ booths, 100,000+ professional visitors.
The same story, softer
English infographic in a sketched, sepia illustration style titled The Great Pivot: from manufacturing to AI infrastructure. A balance scale tips from traditional manufacturing toward AI infrastructure assembly. Left column of highlights: Google's AI infrastructure chief debuting in Asia, silicon photonics and CPO taking centre stage to address data-transmission bottlenecks, the capacity ceiling of advanced packaging with a Chiplet pavilion, and quantum plus smart fab as new standalone zones. Centre: the US$1 trillion year arriving four years early, with 2030 struck through for 2026, and a US$2 trillion market forecast. Right: a record-breaking global pavilion with the highest number of countries ever. Stat strip: 1,300+ exhibitors, 4,300+ booths, 65 participating countries, 18 national pavilions, 100,000+ professional visitors.
The great pivot, sketched
English infographic in a blue neon style titled SEMICON Taiwan 2026: The AI Infrastructure Evolution, subtitled the chip show became an AI-infrastructure show. Headline figures: the US$1 trillion year arrived four years early after SEMI moved the global revenue milestone to 2026 on AI demand, with a new target of US$2 trillion by 2030. Five panels: the pivot to AI infrastructure with Google, NVIDIA and Microsoft on the main stage; Google's AI infrastructure chief Amin Vahdat delivering his first public keynote in Asia; silicon photonics and CPO integration as the main theme for AI-cluster connectivity; advanced packaging and the Chiplet pavilion with the bottleneck shifting from demand to capacity; and quantum plus smart fab established as dedicated zones for the first time. Stat strip: 1,300+ exhibitors, 4,300+ booths, 65 participating countries, 18 international pavilions, 100,000+ professional visitors.
The evolution, in neon

What this year was really about

Six threads ran through the whole week, from the opening keynote to the closing day.

86 item(s)

  1. 2026-09-05
  2. MediaDigitimes AsiaSemicon Taiwan 2026: A windmill in the die bonder, and a Dutch bet on photonicsPost-show dispatch: Dutch equipment maker ITEC showed a die-bonding architecture that it says "triples throughput over earlier versions of the design by removing the largest source of idle motion in chip assembly: the return trip". The Dutch photonics angle in the headline sits behind the paywall.EquipmentNetherlandsPhotonicsdigitimes.com
  3. MediaDigitimes AsiaTaiwan semiconductor output targets NT$8 trillionAs the show opened at Nangang, the Ministry of Economic Affairs said Taiwan's semiconductor industry output could exceed NT$8 trillion, citing forecasts from multiple research institutions. The year the figure refers to, and which institutions, are behind the paywall.GovernmentForecastdigitimes.com
  4. MediaFocus Taiwan (CNA)Made in Taiwan, sovereign in Europe: France's different chip strategyA semiconductor-week feature on an event held the day before the show opened. French President Emmanuel Macron has publicly acknowledged using Taiwan-made chips for European applications; SiPearl CEO Philippe Notton said "three years earlier, hearing this chip is coming from Taiwan would have been almost impossible", describing a strategy that keeps R&D and design in France while relying on Taiwan for manufacturing, such as CEA-Leti's partnership with Powerchip.EuropeGeopoliticsfocustaiwan.tw
  5. 2026-09-04
  6. MediaTaipei TimesSEMI pulls its US$1 trillion milestone forward from 2030 to this yearCiting the order momentum visible at the show, Taiwan's economy minister said SEMI has raised its global semiconductor revenue forecast to US$1tn this year and US$2tn by 2030 — the earlier estimate had put the US$1tn mark at 2030. He tied it to a planned additional US$20bn of Taiwanese investment in the US.Market outlookPolicytaipeitimes.com
  7. MediaDigitimes AsiaQuantumDiamonds cracks the hybrid bonding blind spot with new inline metrologyA startup showing at the metrology forum on closing day: inline measurement aimed at the part of hybrid bonding that existing tools cannot see — the inspection gap that advanced packaging keeps running into.MetrologyAdvanced packagingdigitimes.com
  8. MediaStockFeel中文What is SEMICON Taiwan 2026? This year's highlights and what each exhibitor showedA post-show overview published on closing day: what SEMICON Taiwan is, this year's threads — AI semiconductors, advanced packaging, quantum, smart manufacturing and compound semiconductors — and what TSMC, MediaTek and the equipment makers actually put on the floor, framed around the shift from process scaling to system integration.Recapstockfeel.com.tw
  9. MediaDigitimes AsiaTSMC urges HBM makers to design for X-ray inspection as packaging grows more complexTSMC's Zhihua Zou told the show that HBM and DRAM makers should design their products to be compatible with X-ray inspection: as advanced packaging stacks up, buried defects get harder to find, while the inspection itself must avoid radiation risk to sensitive memory. Full text is behind Digitimes' paywall.TSMCHBMInspectiondigitimes.com
  10. MediaDigitimes AsiaCPO testing shifts to mid-stage to avoid costly failures, Chroma saysJeff Lee, president of Chroma ATE's Photonics & Precision business unit, said chipmakers are pulling co-packaged optics testing earlier in the flow to screen optical engines before final packaging, so that a bad engine is caught before it has been married to an expensive package. Full text is behind Digitimes' paywall.CPOTestdigitimes.com
  11. MediaDigitimes AsiaFrom chips to physical AI: Experts urge Taiwan-US push for trusted drone supply chains at Semicon Taiwan 2026A show-floor panel argued that supply-chain-security thinking is spreading from chips to drones and other autonomous systems, and urged Taiwan and the US to build trusted drone supply chains together. Only the lede is visible; speaker names and quotes are behind the paywall.Supply chainGeopoliticsdigitimes.com
  12. MediaFocus Taiwan (CNA)Nordic R&D expertise can strengthen Taiwan's chip sector: PanelistsA closing-day panel argued that Nordic research strengths complement Taiwan's manufacturing scale. SEMI's Terry Tsao said "Europe has expertise in advanced research, materials, compound semiconductors" while Taiwan excels at scaling and mass production; MediaTek's recruiting of Finnish and Swedish engineers was cited as an example of the two sides already meeting.EuropeTalentForumfocustaiwan.tw
  13. MediaFocus Taiwan (CNA)Taiwan, Lithuania sign pact on advanced packaging for next-gen chipsOn the show's final day Taiwan and Lithuania signed an MOU to jointly develop advanced-packaging equipment, pairing Lithuanian laser expertise with Taiwanese imaging and AI. ITRI president Chang Pei-zen said the aim is to "get private businesses to jointly develop advanced chip packaging equipment"; the two governments will contribute 5.6 million euros over two years.Advanced packagingLithuaniaMOUfocustaiwan.tw
  14. MediaTechNews中文ITRI teams up with Lithuania on high-power ultrafast lasers for AI packaging and next-gen chipsITRI signed an MOU with Lithuania during the show to bring in high-power laser technology. MOEA official Kuo Chao-chung said the cooperation has generated NT$1.5 billion of output since 2023; ITRI president Chang Pei-zen said the targets are AI-server cooling, fibre arrays, and SiC and diamond substrates. Taiwan is putting in 5.6 million euros over two years and expects more than NT$500 million of industrial benefit within five.Advanced packagingLithuaniaMOUtechnews.tw
  15. ExhibitorsTechNews中文Toward Technologies brings 60GHz relays and Opto-SiC MOSFET switchingThe company showed a broadband conical inductor supporting up to 60GHz and an Opto-SiC MOSFET relay combining SiC MOSFETs with optocouplers at kV-class load voltage.New productTaiwan suppliertechnews.tw
  16. ExhibitorsTechNews (Finance)中文Giant Wave shows smart high-safety gas cabinets at SEMICON, starts IPO coaching with NT$3bn order bookGiant Wave showed its smart high-safety gas-cabinet system at the show. CEO Lee Chun-wei said orders in hand exceed NT$3 billion and run through mid-2027, and that the company has started listing coaching with Fubon Securities.Fab facilitiesIPOfinance.technews.tw
  17. ExhibitorsDIGITIMES (Chinese)中文Automotive SoCs are tightly locked in; Hongsuan bets its "AI chiplets" become the automotive mainstreamHongsuan showed automotive MCUs and AI chips at the show. CEO Liu Chin-yun noted that IC-design houses rarely exhibit at SEMICON, and argued that "AI chiplets" will displace today's tightly bound automotive SoCs as the mainstream approach. Full text is behind DIGITIMES membership.AutomotiveChipletsdigitimes.com.tw
  18. 2026-09-03
  19. OfficialSEMISEMI and Silicon Catalyst partner to accelerate global semiconductor innovationAnnounced during show week: an MOU linking SEMI's ecosystem with Silicon Catalyst's startup incubator, connecting founders to investors and manufacturers.StartupsAnnounced at the showsemi.org
  20. MediaCommercial Times中文Taiwan's 'AI five' share a stage for the first time — competition is now a whole-supply-chain fightTSMC, MediaTek, Foxconn, ASE and Unimicron — together worth over NT$76 trillion — appeared together for the first time, spanning foundry, IC design, test and assembly, AI systems and substrates. Their shared message: the contest has moved from single chips to the whole supply chain.CEO SummitSupply chainctee.com.tw
  21. MediaTechNews中文This year's show isn't over and the 2027 booth scramble has already begunA look at how floor space actually gets allocated: priority follows how many years a company has exhibited, so the long-timers pick first and latecomers are left with whatever is off the main aisles.Behind the scenesccc.technews.tw
  22. MediaDigitimes AsiaTSMC doubles down on equipment purchases as AI outpaces supply-chain planningTSMC Deputy Co-COO Cliff Hou told the show its quarterly chipmaking-tool needs had been raised to roughly 1.9× the December estimate, with 2026 capex possibly approaching US$64 billion.TSMCCapexdigitimes.com
  23. MediaDIGITIMES (Chinese)中文A hundred-strong machinery contingent at SEMICON 2026: the association wants to incubate a home-grown equipment chainSince the precision machinery association first set up its own pavilion in 2024, its exhibitor count has grown from a dozen or so to more than a hundred. The association hopes the pavilion incubates a domestic semiconductor-equipment supply chain and shows how much Taiwan's precision-machinery sector matters to its chip industry. Full text is behind DIGITIMES membership.EquipmentLocal supply chaindigitimes.com.tw
  24. MediaThe Quantum InsiderSEEQC signs MOU to expand quantum technology cooperation in TaiwanReporting SEEQC's announcement: CTO Dr. Shu-Jen Han signed an MOU with Taiwan's Quantum Industry Technology Promotion Office during SEMICON Taiwan 2026, setting a framework for collaboration across technology and product development, manufacturing, testing and validation, commercialisation and supply-chain development for its cryo-CMOS and SFQ quantum platform. Han also spoke at the Quantum Taiwan Forum alongside IBM, Fujitsu, Google, NVIDIA, Xanadu and D-Wave.QuantumMOUthequantuminsider.com
  25. ExhibitorsAnue Cnyes中文Yuchen sells clean air by subscription: regenerable chemical filtersA smaller Taiwanese supplier's angle on sustainability — regenerable chemical filters sold as a 'clean air subscription' rather than as consumables. First-half revenue was up 53.1% year on year.SustainabilityTaiwan suppliernews.cnyes.com
  26. ExhibitorsCNA中文Qisda Group targets CPO with a 160-channel fiber array unit lineThree group companies exhibited: dry-ice cleaning modules for precision cleaning, electronic fluorinated liquid for tool temperature control and server cooling, and a 160-channel FAU one-stop manufacturing solution aimed at CPO volume production.CPOTaiwan suppliercna.com.tw
  27. ExhibitorsTechNews中文Applied Materials on CPO's thermal problem: optics don't just slow down, they moveAn Applied Materials VP explained that heat in co-packaged optics causes physical displacement of optical components rather than a graceful performance drop, making whole-process control and defect inspection the real requirement.CPOApplied Materialstechnews.tw
  28. ExhibitorsTechNews中文Merck completes NT$17 billion Taiwan investmentMerck announced its roughly NT$17bn (€500m) Taiwan investment is complete, with its CEO arguing that classical scaling alone can no longer carry industry growth.MaterialsInvestmenttechnews.tw
  29. 2026-09-02
  30. OfficialITRI (via GlobeNewswire)Semicon Network Summit 2026 advances global chip collaboration in the AI eraCo-organisers ITRI and SEMI said more than 600 government officials, industry leaders and researchers from 38 countries attended the 1 September summit in Taipei. President Lai Ching-te presented the Medal of Economic Contribution to Doris Hsu of Sino-American Silicon Products and GlobalWafers and to Micron CEO Sanjay Mehrotra. The summit set four priorities: advanced technologies and materials, cross-border collaboration in silicon photonics, chips for AI robotics, and semiconductor cybersecurity resilience.Network SummitGovernmentglobenewswire.com
  31. MediaBusiness Next中文Google expands its Shilin R&D centre by 60%, confirms Taiwan as its largest hardware engineering base outside the USThe concrete announcement out of Amin Vahdat's keynote. Taiwan's team brings up and validates new silicon the moment it comes off TSMC's line, and TPU cadence has gone from one generation every two years to two in the past year.KeynoteAI infrastructurebnext.com.tw
  32. MediaCNA中文Taiwanese firms added US$20bn of US investment in three months, taking the total to US$55bnThe precise version of the investment number: 20 companies had pledged US$35bn, and roughly US$20bn more was added over the past three months, bringing the running total to about US$55bn.PolicyInvestmentcna.com.tw
  33. MediaLiberty Times中文Deloitte flags three trends to watch at the showAn advisory read on the same show floor: technology integration (chiplets, HBM, CPO), building core capability rather than just adding capacity, and whether suppliers follow their customers overseas as supply chains reorganize.Analysisec.ltn.com.tw
  34. MediaDigitimes中文A record show, pitched as a whole-value-chain play for the AI eraThe Chinese-language overview of the show: 1,300 companies and 4,300 booths, both records, spanning advanced packaging, AI chips and optical communications end to end.Scaledigitimes.com.tw
  35. MediaCRNTT中文SEMI hands its first Semiconductor Partnership Leadership Award to the AIT directorFirst-hand reporting from the opening ceremony: the premier attended with the economy minister and the NSTC head, then toured the US pavilion. At the ceremony SEMI gave a first-of-its-kind partnership leadership award to AIT's director for his role in US-Taiwan chip cooperation. The premier's remarks put the number of national pavilions at 19.OpeningAwardshk.crntt.com
  36. MediaAnue Cnyes中文US pavilion opens as Taiwan announces another US$20 billion of US investmentThe Chinese-language opening-day account of the US pavilion ribbon-cutting, where the economy minister put a further US$20bn of Taiwanese investment in the US on the table — on top of the US$35bn pledged in May.OpeningPolicynews.cnyes.com
  37. MediaTaipei TimesLai touts industrial connections at SemiconAt the Semicon Network Summit the president argued chips have built 'a more diversified and resilient supply chain'; a US undersecretary, appearing by video, called semiconductors 'the single most important technology of our lifetime'.OpeningPolicytaipeitimes.com
  38. MediaCRNTT中文Queues out the door on day one as the show hits a new highOn-the-ground reporting from opening day: queues formed outside the Hall 2 ceremony before doors opened, entry split into Express and general lanes, with a notably high share of international visitors.On the groundScalehk.crntt.com
  39. MediaDigitimes AsiaSemicon Taiwan 2026 signals a broader race for AI-era leadershipFraming piece arguing the show has expanded beyond chipmaking into packaging, smart fab, quantum technology and system integration.Analysisdigitimes.com
  40. MediaTaipei Times · ReutersTaiwanese companies plan to invest another US$20bn in US amid AI boomReuters report carried by the Taipei Times: speaking at the opening of the US pavilion at SEMICON Taiwan, Economic Affairs Minister Kung Ming-hsin said Taiwanese firms plan an additional US$20 billion of US investment — mainly chip supply-chain and AI-server companies — on top of the US$35 billion pledged by 20 companies at May's SelectUSA summit. A US Commerce Department official said it "demonstrates our continued shared commitment to a secure, resilient and innovative semiconductor and electronics supply chain".US investmentGovernmenttaipeitimes.com
  41. MediaDIGITIMES (Chinese)中文CPO materials platform has not converged; Taiwan vies for a key seat through heterogeneous integration and advanced packagingFrom the silicon-photonics session of the show's Silicon Chain Summit — with Marvell, the Netherlands' TNO Holst Centre, a UK semiconductor centre and TSIA among the speakers — DIGITIMES argues the CPO materials platform has yet to converge, and that Taiwan's seat at the table rests on heterogeneous integration and advanced packaging. Full text is behind membership.Silicon photonicsCPOForumdigitimes.com.tw
  42. MediaFocus Taiwan (CNA)Premier highlights Taiwan's key role in global AI developmentOpening-day report: Premier Cho Jung-tai told the show that Taiwan's semiconductor production value reached US$209.1 billion in 2025, up 22.7%, and pledged land, energy, talent and financing to keep the industry expanding. SEMI president Ajit Manocha said AI could lift global semiconductor revenue to US$2 trillion by 2030; the show drew more than 1,300 exhibitors from over 60 countries.Opening ceremonyGovernmentfocustaiwan.tw
  43. MediaFocus Taiwan (CNA)U.S., U.K., France envoys open national pavilions at 2026 SEMICON TaiwanThree of the record 18 national pavilions were opened by their envoys on day one. AIT director Raymond Greene said "the U.S.-Taiwan semiconductor partnership has never been stronger"; new French Office director Frédéric Laplanche noted a record 10 French participants; the UK's Ruth Bradley-Jones called her delegation "the biggest group of U.K. companies we've ever had", focused on photonics and advanced packaging.National pavilionsGeopoliticsfocustaiwan.tw
  44. MediaNOWnews中文Fireside chat: Foxconn's Young Liu wants "made with Taiwan", not "made in Taiwan"Report on the master-forum fireside chat moderated by ASE's Tien Wu with TSMC's Cliff Hou, MediaTek's Rick Tsai and Foxconn's Young Liu. Liu argued Taiwan should move from "Made in Taiwan" to "Made with Taiwan"; Hou said equipment demand went from baseline to 1.9× within six months, with TSMC building close to 20 fabs at once.Fireside chatFoxconnTSMCnownews.com
  45. MediaSETN中文Master forum chat: TSMC and MediaTek name Taiwan's bottlenecksAnother angle on the same 2 September fireside chat: TSMC's Cliff Hou said equipment purchases jumped from baseline to 1.5× within a quarter and 1.9× by July, and that TSMC is building 13 fabs in Taiwan plus five or six overseas — close to 20 at once versus four or five in earlier cycles — which is why land, power, people, equipment and materials all have to scale together.Fireside chatTSMCCapacitysetn.com
  46. MediaGlobal Views Monthly中文AI bubble? WinWay executive: everyone has it backwards — the choke point is a supply chain that can't shipInterviewed at the show, WinWay vice president Chen Shao-kun said the problem is supply, not demand: test-interface pin counts have gone from 5,000–6,000 to over 10,000 and lead times from 8 weeks to 13–14, with capacity expected to grow another ~50% after mid-2027. The company has more than ten CPO projects in hand, with small shipments in the second half of 2027 and volume in 2028.TestCPOCapacitygvm.com.tw
  47. ExhibitorsAnue Cnyes中文Tongtai's semiconductor and electronics share rises to 40% on localisation and AI serversA machine-tool maker repositioning into the chip supply chain: its chairman put semiconductor and electronics at 40% of business, driven by domestic substitution and demand for thick plate in AI servers.Taiwan supplierEquipmentnews.cnyes.com
  48. ExhibitorsHermes-Epitek中文Hermes-Epitek shows SiC substrates and a quantum technology lineupAlongside its ion implanter, ICP etcher and MOCVD systems and 8/12-inch SiC substrates, the company made its first quantum-zone showing with superconducting film epitaxy, SNSPD single-photon detectors and photonic quantum chips.QuantumTaiwan supplierhermes.com.tw
  49. ExhibitorsKLAKLA at booth M0248, with talks at the CEO Summit and 3DIC SummitThe company's official show page: wafer-handling and chemical process control on the floor, plus its semiconductor products president speaking at the CEO Summit.Process controlkla.com
  50. ExhibitorsSEMICON Taiwan exhibitor press platform · Hypersonic中文Hypersonic links global partners into a packaging, test, materials and smart-manufacturing platformFiled on SEMI's official exhibitor press-release system (booth N0762): Hypersonic (TWSE 7894) said it is showing packaging, test, materials, in-house equipment and automation-integration solutions, positioning itself as the bridge between global equipment and materials partners and local process-integration service for AI, HPC and advanced-packaging customers.Advanced packagingTestexpo.semi.org
  51. USTV (YouTube)中文Opening-day TV report: quantum and advanced packaging as this year's new drawsTaiwanese business television's opening-day piece, singling out the new Quantum Technology Zone and advanced packaging as what changed this year.VideoOpeningyoutube.com
  52. TaiwanPlus News (YouTube)Semicon Taiwan 2026 kicks off in TaipeiOpening-day video report from the show floor.VideoOpeningyoutube.com
  53. YouTube中文Walking the floor: the Taiwanese test and packaging suppliers behind TSMCA finance channel walks the show floor booth by booth through Taiwan's test, probe-card and equipment suppliers — the closest thing to a first-hand visitor walkthrough that surfaced.On the groundSupply chainyoutube.com
  54. YouTube · ET DigitalTaiwan: Semicon Network Summit 2026 drives global semiconductor partnershipsA news video on the Semicon Network Summit held in Taipei on 1 September — the government-and-industry forum co-organised by ITRI and SEMI that runs alongside the show during International Semiconductor Week. It covers the summit rather than the exhibition floor itself.VideoNetwork Summityoutube.com
  55. 2026-09-01
  56. MediaLiberty Times中文President Lai hands out economic contribution medals at the Chip Chain SummitThe Chinese account of the summit, held at Nangang Hall 2 alongside the show: the president awarded economic contribution medals to the chair of GlobalWafers/Sino-American Silicon and to Micron's CEO, citing Nvidia's annual Taiwan procurement of over NT$3tn and Micron's over NT$1.4tn of local investment.OpeningAwardsec.ltn.com.tw
  57. MediaDigitimes AsiaSEMI lifts 2028 wafer fab equipment forecast to US$220 billionShow-floor forecast numbers: 2026 WFE spend projected up 23.1% to US$143.9bn, 300mm fab equipment around US$133bn (+18%), foundry/logic WFE up 18.9% on 2nm and sub-2nm buildouts.Market outlookEquipmentdigitimes.com
  58. MediaDigitimes AsiaAI packaging demand surges — ASE EVP names two manufacturing bottlenecksASE's executive vice president used the show to identify where advanced-packaging capacity actually binds, rather than to talk up demand.Advanced packagingASEdigitimes.com
  59. Mediamashdigi中文'Dream Fab' micro-fab exhibit opens up chipmaking in four stationsSEMI and ten partners built a working miniature fab on the show floor: an ASML High-NA EUV lithography model, SCREEN wafer cleaning, Gudeng FOUP carriers, overhead transport, plus Advantest and MPI test and probe-card stations.Show floorTalentmashdigi.com
  60. MediaTaiwanPlusExplainer: What to know about Semicon Taiwan 2026A 3:25 video explainer published the evening before opening day: Taiwan makes over 90% of the world's most advanced chips and its industry revenue is expected to near US$300 billion in 2026, up about 40%. SEMI Taiwan president Terry Tsao says "the face of the industry is being reshaped"; TrendForce's Joanne Chiao points to chipmakers moving toward "Foundry 2.0", building out both upstream and downstream of the value chain.ExplainerVideotaiwanplus.com
  61. MediaTaipei TimesIntegrated systems to lead AI boom: TSMC executiveAt the show's IC forum, TSMC's April Li said "market leaders will not be the ones who simply make better models, but those who build the most integrated systems". She said global inference token volume has grown roughly 500-fold since 2022, and that moving data now accounts for up to 60% of system activity.TSMCAI infrastructureForumtaipeitimes.com
  62. ExhibitorsPR Newswire · Kulicke & SoffaKulicke & Soffa advances AI infrastructure through co-packaged optics and advanced packagingPre-show release: K&S said its fluxless thermo-compression bonding supports emerging co-packaged optics for AI infrastructure, enabling higher-bandwidth, more energy-efficient networking, and that it would showcase key features of its expanding Advanced Solutions portfolio at SEMICON Taiwan on 2–4 September.CPOAdvanced packagingprnewswire.com
  63. ExhibitorsSEMICON Taiwan exhibitor press platform · DAS Environmental ExpertDAS Environmental Experts introduces ALCEA for integrated NOx treatment in semiconductor fabsDresden-based DAS launched ALCEA, a plasma-enhanced catalytic secondary NOx abatement system that sits directly in the exhaust duct, cutting subfab floor space and energy demand while reducing NOx emissions by up to 95%. Developed with ITRI and shown at booth J2346.Fab facilitiesSustainabilityexpo.semi.org
  64. 2026-08-31
  65. MediaLiberty Times中文A talent summit on the eve of the show: US$20m to Arizona and more Fulbright places at NYCUThe workforce thread the show usually only gestures at: at a semiconductor talent summit the AIT director announced a US$20m gift to the University of Arizona to support students studying in Taiwan, and two more Fulbright semiconductor scholars heading to NYCU next year.TalentPolicynews.ltn.com.tw
  66. MediaTrendForceShow highlights AI infrastructure and CPO; Google AI chief technologist makes Asia keynote debutCalls this the largest edition on record. Google's Amin Vahdat gives his first public keynote in Asia on custom chips, data centers and high-speed networking; TSMC's session covers heterogeneous integration for the AI era.KeynoteAI infrastructuretrendforce.com
  67. MediaTrendForceTSMC: SoIC and CoWoS to drive 50× compute by 2029; silicon photonics to top 50% of transceiver market by 2027TSMC put numbers on the roadmap: N2P-on-N3P in 2026 through A14-on-A14 in 2029, and a COUPE platform moving optical bandwidth from 3.2Tbps to above 12.8Tbps.TSMCSilicon photonicstrendforce.com
  68. MediaTaipei TimesSemicon to put spotlight on CPO, silicon photonicsPreview of the show's central technical theme: co-packaged optics as the answer to data-center bandwidth and power limits.Silicon photonicsCPOtaipeitimes.com
  69. MediaTech TimesSEMICON Taiwan 2026 kicks off: AI chips' bottleneck is the wires connecting themOpening-day framing of the week's central argument — interconnect, not transistor count, is what now limits AI systems.Interconnecttechtimes.com
  70. MediaTechOrange中文Silicon Photonics Forum: CPO enters volume production in the second half — what is the next hurdle?Floor report from the Silicon Photonics Forum: TSMC's Hsu Kuo-chin said optical transceiver sales grew 25% and are expected to grow another 50% this year, with CPO entering volume production in the second half — the bottleneck shifting to lasers, fibre, connectors and test. TSMC's Chen Ming-fa outlined the move from CPO-C to a more tightly integrated CPO-OI, presented as 4–10× better power efficiency and 10–20× lower latency; Cisco, Marvell, Lumentum, UMC and Lightmatter also spoke.Silicon photonicsCPOForumtechorange.com
  71. ExhibitorsTechNews中文Corning shows advanced optical and glass solutions at SEMICON Taiwan, from CPO to glass substratesCorning showed glass and materials aimed squarely at chipmaking: ultra-low-expansion glass for EUV/DUV lithography, high-performance glass for fan-out panel-level and 3D packaging, optical solutions for co-packaged optics, and glass-core substrates built on through-glass vias. Development director Chiang Chen-kuo said advanced packaging, heterogeneous integration and AI keep raising the bar for semiconductor materials.MaterialsGlass substrateCPOtechnews.tw
  72. 2026-08-30
  73. MediaCNA中文Where Taiwan's silicon photonics actually stands — TSMC, UMC, Foxconn and Largan by nameConcrete progress rather than roadmaps: TSMC's CPO solutions entering production this year on the COUPE platform, UMC's Singapore fab shipping its first volume silicon photonics wafers with SILITH, Foxconn's CPO switches ramping through Q3, and Largan setting up its first CPO pilot line.Silicon photonicsSupply chaincna.com.tw
  74. MediaUDN中文The Chinese-language framing: three main threads for this yearHow Taiwanese media summarised the programme before it opened: advanced packaging and heterogeneous integration, silicon photonics, and panel-level fan-out packaging.Previewudn.com
  75. MediaFocus TaiwanSEMICON Taiwan 2026: what to watchPreview with the official numbers — 1,300+ exhibitors, 4,300 booths, 65 countries, 18 national pavilions, 100,000+ attendees — and notes cloud and data-center firms are featured for the first time.PreviewScalefocustaiwan.tw
  76. MediaFocus TaiwanSEMICON Taiwan to spotlight silicon photonics, CPO commercializationCites TSMC's COUPE platform progress and Nvidia's Spectrum-X CPO switches entering production, calling 2026 a pivotal year for large-scale optical interconnect.Silicon photonicsCPOfocustaiwan.tw
  77. TaiwanPlus News (YouTube)Record number of participating countries join SEMICON Taiwan 2026Report on the global pavilion reaching a record 18 countries, with Spain, Mexico and Finland joining for the first time.VideoInternationalyoutube.com
  78. 2026-08-28
  79. HK Business Wire (LinkedIn)Smart manufacturing zone grows 20% to become the show's largestPost summarising the floor-plan shift: smart manufacturing up 20% year on year to become the largest zone, advanced packaging up 6% as the second largest, with new 3DIC, FOPLP, packaging and chiplet areas.ZonesSmart manufacturinglinkedin.com
  80. 2026-08-27
  81. RENA Technologies (LinkedIn)RENA to show through-glass-via panel processing and wet process automationAn exhibitor's own pre-show post describing what it brought to the floor — glass-substrate TGV panel equipment and fully automated wet processing.Glass substrateExhibitor postlinkedin.com
  82. 2026-08-26
  83. ExhibitorsPR NewswireE&R Engineering launches five-axis laser drilling and hybrid plasma systems for CPOTaiwanese supplier E&R Engineering introduced a ±0.5μm five-axis FAU laser drilling system and a dual-source hybrid plasma system aimed at fiber array units, glass substrates and through-glass vias.New productTaiwan supplierprnewswire.com
  84. 2026-08-25
  85. MediaUDN中文The stock exchange sets up an innovation-board booth for four chip startupsAn angle the international coverage missed entirely: Taiwan's stock exchange took floor space in Hall 2 to showcase four innovation-board semiconductor companies — FPGA chips, precursor materials, AI chip design security and solid-state MEMS speakers — and to talk listing with them.StartupsCapital marketsudn.com
  86. MediaCNA中文Badge pickup at five high-speed rail stations, stitching the tech corridor togetherA practical detail worth knowing before you go: SEMI worked with Taiwan High Speed Rail so badges could be collected at the Taoyuan, Hsinchu, Taichung, Tainan and Kaohsiung stations, rather than only on site.Visitingcna.com.tw
  87. 2026-08-24
  88. MediaTVBS News中文SEMICON Taiwan 2026 cheat sheet: a record 18 national pavilions, and six trends from silicon photonics to advanced packagingPre-show explainer: 1,300 exhibitors, 4,300 booths, 65 countries, 100,000+ professionals and 18 national pavilions, organised around six directions — AI chips, advanced packaging, chiplets, quantum, silicon photonics and green manufacturing — and citing SEMI's forecast of US$165.9 billion in 2026 global equipment sales, up 23.2%.Previewnews.tvbs.com.tw
  89. ExhibitorsCNA via PChome中文Lam Research brings etch, photonics, FOPLP and digital-twin talks to the showSix Lam specialists spoke across forums on plasma etch for 3D manufacturing, silicon photonics and CPO, panel-level fan-out, digital-twin yield optimisation, robotic maintenance and hybrid bonding.EquipmentForumsnews.pchome.com.tw
  90. 2026-08-21
  91. ExhibitorsTechNews中文ASE raises 2026 capex to US$10.5 billion, joins SEMI materials consortiumAt the founding of SEMI's semiconductor materials consortium, ASE said 2026 capex rises to US$10.5bn — about US$4bn for facilities and US$6.5bn for production equipment.ASECapexfinance.technews.tw
  92. 2026-08-19
  93. OfficialSEMISilicon Startups Zone doubles in sizeOver 40 startups in the Silicon Valley startup area — double the previous edition — with the innovation showcase growing from 6 to 16 companies, plus a new Silicon Valley Startup Stage and SEMI Venture Day.StartupsZonessemi.org
  94. OfficialSEMI (via PR Newswire)SEMICON Taiwan 2026 highlights AI-driven manufacturing transformationTwo weeks before opening, SEMI set out 15 key themes for the show and said 300mm fab equipment spending is projected to exceed US$150 billion in 2027. The Smart Manufacturing Pavilion grew 20% year on year to become the largest exhibition area, with the Packaging Technology Area up 6% in second place; advanced packaging and assembly equipment sales hit a record US$6 billion in 2025 and are expected to grow 9.2% in 2026. SEMI's Terry Tsao framed AI-era competition as running on two fronts: AI-powered smart manufacturing and advanced packaging.Smart manufacturingAdvanced packagingForecastprnewswire.com
  95. ExhibitorsTechNews中文Applied Materials on panel-level packaging; Qnity CEO takes the Master Forum stageApplied Materials presented its panel-level electrochemical deposition portfolio and explained how maskless digital imaging improves pattern accuracy and yield on large panels.Advanced packagingFOPLPtechnews.tw
  96. 2026-08-15
  97. MediaFocus TaiwanSEMICON Taiwan 2026 forum to expand to full-day formatThe CEO Summit and Ecosystem Executive Summit become a full-day program for the first time, held Sept 2 at TaiNEX Hall 2.CEO Summitfocustaiwan.tw
  98. 2026-08-14
  99. OfficialSEMIFirst full-day CEO Forum and Ecosystem Executive Summit — full speaker listThe official lineup: Amin Vahdat (Google) opening, plus Rani Borkar (Microsoft), Manish Bhatia (Micron), Asad Khamisy (Broadcom), Alexander Gorski (Infineon), CQ Tang (Meta) and Michael Kagan (Nvidia). Closing panel chaired by ASE's Tien Wu and TSIA's Cliff Hou.CEO SummitKeynotesemi.org
  100. 2026-07-22
  101. MediaTechNews中文SEMICON Taiwan 2026 draws 18 countries; global-zone booths hit a record, up 250% in three yearsFrom the Global Zone press conference on 22 July: 18 countries and 220 booth spaces in the global zone, up more than 250% since 2023, with Catalonia, Chihuahua and Finland joining for the first time. SEMI Taiwan president Terry Tsao said global AI-infrastructure build-out is reshaping how the industry develops and collaborates; SEMI's forecast put 2026 global equipment sales at US$165.9 billion, up 23.2%, rising to US$229.5 billion by 2028.National pavilionsPreviewtechnews.tw
  102. 2026-05-20
  103. OfficialSEMI中文SEMICON Taiwan 2026 launches with four new spotlight zonesThe kickoff release: 1,300+ exhibitors and 4,300+ booths, both records, with the Quantum Technology and Smart Fab zones debuting and a Chiplet Pavilion added to the packaging area.ScaleZonessemi.org
  104. OfficialSEMI中文SEMI 20 Under 40 awards, second editionThe award returns for a second year with a new industry-academia category, honouring 20 people under 40 from across the Taiwanese chip ecosystem.AwardsTalentsemi.org

Independently compiled from public reporting and public posts during show week (Aug 31 – Sep 4, 2026). Every link was opened and checked against its headline before being listed; sources that could not be reached were left out. Figures are quoted as the source reported them.

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